Ansys 2026 R1 introduces generative AI and the portfolio's first agentic capabilities, bolstering an AI-enhanced portfolio that accelerates validation, speeds design exploration, and automates complex ...
Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16™ with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
Latest release fuels collaboration and digital transformation by connecting workflows, integrating AI, and optimizing complex design tasks / Key Highlights Unified Ansys technology reduces the need ...
Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...
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