Business Wire

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
AZoNano

Increasing Wafer Yield with Semiconductor Wafer Stealth Dicing Methods by Intelligent Motion / Laser Control Algorithms and Motion Stages

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...