Interconnect company, Molex continues its acquisition trail with the announcement that it is to acquire Smiths Interconnect. The announcement comes less than a year after its acquisition of AirBorn, ...

MEMS-based loudspeaker company xMems Labs has appointed Chester Hwang as CTO.

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a call for papers around the theme: “Advancing the ...

Arm has contributed a vendor-neutral version of its Foundation Chiplet System Architecture (FCSA), to the Open Compute Project (OCP) under their permissive open licensing policy. As vehicles integrate ...

Positioned at 18° latitude, near the equator, Etlaq Spaceport provides access to Equatorial, Sun-Synchronous (SSO), Polar, Medium Earth (MEO), and Geostationary Transfer (GTO) orbits. Its coastal ...

The great thing about being a Secretary of State is that you can meet so many people in the course of a day that you are in ...

JEDEC has announced an update of the DDR5 Serial Presence Detect (SPD) Contents standard, JESD400-5D. The SPD data is used by ...

The ACS RTDI (Advanced Cloud Solution RealTime Data Infrastructure) software uses AI to test advanced chips, says Advantest.

Renesas has seen itself as a one-stop-shop for timing products including oscillators, buffers, clock synthesisers, clock ...

Samsung is reported to be paying $773 million for two high-NA EUV machines – the Twinscan EXE:5200B – with one for delivery ...

GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV have signed up for imec’s Automotive Chiplet Programme (ACP) ...

It is called ‘NB IoT 6 Click’, and its active wireless module is the BC65 from Shanghai based Quectel, a low-power (4μA) ...