A long-standing RIBER customer for more than twenty years, 3SP Technologies has once again reaffirmed its confidence in the Company's technologies through this new order, further ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Applied Materials has launched a range of new production systems aimed at the 3D chip architectures used in advanced AI ...

With Thermal Laser Epitaxy (TLE), epiray has commeralized a novel core technology that enables the production of high-purity thin films for key sectors such as microelectronics and quantum computing.

Hunan Key Laboratory of Nanophotonics and Devices, Hunan Key Laboratory of Super Microstructure and Ultrafast Process, School of Physics, Central South University, Changsha, Hunan 410083, China State ...

Forward-looking: It's been years in the making but UltraRAM is finally showing meaningful progress towards commercial production. Earlier this summer, IQE plc – a leading supplier of advanced wafer ...

The news about TSMC exiting the gallium nitride (GaN) foundry business has stunned the semiconductor industry, also laying the groundwork for integrated device manufacturers (IDMs) like Infineon ...

Researchers grow single-crystal GaN films on amorphous glass using a chemically converted molybdenum nitride buffer, removing the need for crystalline substrates in epitaxy (Nanowerk Spotlight) The ...

Abstract: Silicon epitaxy is critical for customizing film resistivity and enhancing breakdown voltage in advanced automotive devices. However, process-induced wafer non-uniformity can lead to ...