Global Non-UV Dicing Tapes Market to Reach $1.55 Billion by 2030 as Advanced Semiconductor Manufacturing Accelerates

Opportunities center on ultra-thin, low-residue, high-cleanliness pressure-sensitive tapes for precision wafer singulation ...
IEEE

2 μm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singulation

Abstract: To preserve the bonding surface quality, this paper proposes and demonstrates the feasibility of incorporating an inorganic protective layer in the direct die-to-wafer (D2W) hybrid bonding ...
IEEE

Laser dicing of chip scale and silicon wafer scale packages

Abstract: Singulation of PCB based chip scale packages as well as the dicing of silicon based flip chip or wafer scale packaging is becoming critical. With the use of batch processes for PCB circuit ...