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Core Molding Technologies Inc. Core Molding Technologies, Inc. is an engineered materials company specializing in molded thermoplastic and thermoset structural products, principally in building ...

Abstract: Molding process of packages is the key link in IC packages and test. Epoxy resin is melted to fill into a specific mold to coat the chip. Filling the cavity with dissatisfaction will lead to ...

Abstract: With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the ...

We independently select these products—if you buy from one of our links, we may earn a commission. All prices were accurate at the time of publishing. When you move into a home, especially a ...

Automate Injection Molding Simulation With Autonomous Optimization Simulation not only predicts how a mold will fill, but also provides guidance to make it fill better. The new technology of ...

Plastics processes and technologies include additive manufacturing, blow molding, compounding, robotic automation, injection molding, extrusion, feeding and blending, heating and cooling, drying, ...