Interconnect company, Molex continues its acquisition trail with the announcement that it is to acquire Smiths Interconnect. The announcement comes less than a year after its acquisition of AirBorn, ...

MEMS-based loudspeaker company xMems Labs has appointed Chester Hwang as CTO.

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits has announced a call for papers around the theme: “Advancing the ...

Arm has contributed a vendor-neutral version of its Foundation Chiplet System Architecture (FCSA), to the Open Compute Project (OCP) under their permissive open licensing policy. As vehicles integrate ...

Positioned at 18° latitude, near the equator, Etlaq Spaceport provides access to Equatorial, Sun-Synchronous (SSO), Polar, Medium Earth (MEO), and Geostationary Transfer (GTO) orbits. Its coastal ...

The great thing about being a Secretary of State is that you can meet so many people in the course of a day that you are in ...

JEDEC has announced an update of the DDR5 Serial Presence Detect (SPD) Contents standard, JESD400-5D. The SPD data is used by ...

The ACS RTDI (Advanced Cloud Solution RealTime Data Infrastructure) software uses AI to test advanced chips, says Advantest.

Samsung is reported to be paying $773 million for two high-NA EUV machines – the Twinscan EXE:5200B – with one for delivery ...

GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV have signed up for imec’s Automotive Chiplet Programme (ACP) ...

It is called ‘NB IoT 6 Click’, and its active wireless module is the BC65 from Shanghai based Quectel, a low-power (4μA) ...