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Abstract: With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the ...

Abstract: Molding process of packages is the key link in IC packages and test. Epoxy resin is melted to fill into a specific mold to coat the chip. Filling the cavity with dissatisfaction will lead to ...