Researchers from National Yang Ming Chiao Tung University (NYCU) and Chung Yuan Christian University have published “A Cross-Validated DSPN and Worst-Case Response-Time Framework for Timing Analysis ...
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...
A new architecture enables higher data rates and densities while remaining pin-compatible with traditional DIMM.
The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.
Reliable performance at higher data rates requires tight coordination between clocking, power delivery, and system-level management.
As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, conventional die-to-die interconnect technologies—such as SerDes-based links and wide ...
As AI models drive compute demand, servers keep getting bigger. Rack‑scale AI systems (such as the 72-GPU systems from NVIDIA or AMD) enable many GPUs to work together through system-level ...
How agents can be used to divide and conquer IC design problems.
Ayar Labs and Wiwynn A CPO link is in one direction from the driving laser through the optical engine (OE) on the XPU, ...
PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and even some scale-up. CXL is seeing uptake, and some even think it could ...
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